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List of KIMM TechnologiesAdvanced Manufacturing Systems Research Division

A Core Technology for Fine Metal Formation Targeting for Flexible/ Stretchable Device and Display

Division Advanced Manufacturing Systems Research Division > Department of Ultra-Precision Machines and Systems
Name Dr. Yongkin Kim, Dr. Seungman Kim, Dr. Junyeob Song (Director)
Department Department of Ultra-Precision Machines and Systems, Advanced Manufacturing Systems Research Division
Tel +82 - 42 - 868 – 7597, +82 - 42 - 868 – 7144
E-mail yjkim@kimm.re.kr, kimsm@kimm.re.kr, sjy658@kimm.re.kr
Attachment Download 010_A_Core_Technology_for_Fine_Metal_Formation_Targeting_for_FlexibleStretchable_Device_and_Display.pdf (0.7 KB)

Developing a new concept for High device performance/high flexibility The formation of Fine metal patterns(≤100 μm)for FHE(flexible hybrid electronics) and the fabrication of 3D step height metal interconnection

DI(direct imaging) technology for creating non-damaging fine pattern(≦100 μm)/pitch(≦20 μm) for stretchable device and display

 

Client / Market

  • Technical field for FHE (flexible hybrid electronics)
  • Technical field for DI (direct imaging) fine pattern/pitch formation for non-damaging flexible/stretchable display areas

 

Necessity of this Technology

  • When using existing mass production MEMS Fab. process/equipment, the process cannot be performed if there is step height (≧5 μm) between the substrate and the thin chip (equipment / process compatibility issue).
  • n forming 3D interconnection, wire-bonding creates mechanical damage of less than 50 μm to the thin chip due to heat, pressure, and ultrasonic energy.
  • Absence of face-up 3D metal interconnection technology to fabricate fine pattern (≦ 100 μm) pitch (≦20 μm)
  • Absence of technology that can form flexible/stretchable pattern without damaging low Tg flexible/stretchable substrate (wiring printing and sintering technology)
  • Therefore, to overcome such problems, it is necessary to develop DI type nondamaging fine pattern/pitch creation technology.

 

Technical Differentiation

  • Technology to effectively form 3D interconnection masklessly without causing mechanical damage to the thin chip with thickness below 50 μm mounted on the flexible/stretchable substrate
  • Technology to create fine pattern (≦100 μm)/pitch (≦20 μm) with the DI (direct imaging) method
  • Technology to sinter ink material on the flexible/stretchable substrate without thermal damage
  • Technology for intrinsically/geometrically robust metal pattern formation for stretchable display
  • Technology to rework and repair for mass production yield improvement

 

Excellence of Technology

  • Formation of 100 μm×100 μm (thickness≈5 μm) micro-LED top & bottom electrodes and securing face-up 3D metal interconnection (line width ≦ 30 μm)
  • Securing DI micro metal pattern method when line width is below 10 μm
  • Establishment of database by ink material for overcoming 3D step height in the flat (0 μm) to 50 μm area
  • Securing sample production technology for micro step height (flat (0 μm) to 50 μm) control for DI process and ink property evaluation
  • Performance of laser sintering test for non-damaging ink sintering on polymer substrate

 

Current Intellectual Property Right Status

PATENT
  • Wearable Dry Patch Type Hybrid Substrate and Manufacturing Method (KR1756847)
  • Non-penetrating, Superhydrophobic Polyimide Film Manufacturing Method (KR1641207)
  • Elastic Device Manufacturing Method and Elastic Device Manufactured with the Method (KR2017-0133265)
  • Electrode Pattern Formation Using Laser Sintering and Electrode Pattern Formation System for the Method (KR2017-0060814)
KNOW-HOW
  • Non-damaging, DI fine pattern/pitch formation technology
  • Face-up 3D step-covered metal interconnection technology
  • Intrinsically/geometrically flexible or stretchable metal formation technology
  • Repair and maskless process technology for yield improvement

 

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